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Automotive SMD Chip Capacitor TI TPS23755RJJT 55 To 120 ℃ EAR99 ECCN

China Yingxinyuan Int'l(Group) Ltd. certification
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Automotive SMD Chip Capacitor TI TPS23755RJJT 55 To 120 ℃ EAR99 ECCN

Automotive SMD Chip Capacitor TI TPS23755RJJT 55 To 120 ℃ EAR99 ECCN
Automotive SMD Chip Capacitor TI TPS23755RJJT 55 To 120 ℃ EAR99 ECCN Automotive SMD Chip Capacitor TI TPS23755RJJT 55 To 120 ℃ EAR99 ECCN Automotive SMD Chip Capacitor TI TPS23755RJJT 55 To 120 ℃ EAR99 ECCN Automotive SMD Chip Capacitor TI TPS23755RJJT 55 To 120 ℃ EAR99 ECCN Automotive SMD Chip Capacitor TI TPS23755RJJT 55 To 120 ℃ EAR99 ECCN

Large Image :  Automotive SMD Chip Capacitor TI TPS23755RJJT 55 To 120 ℃ EAR99 ECCN

Product Details:
Place of Origin: N/S
Brand Name: Texas Instruments
Certification: /
Model Number: TPS23755RJJT
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: Negotiation
Delivery Time: 2-7 work days
Payment Terms: T/T
Supply Ability: 9999999+PCS
Detailed Product Description
Operating Temperature: 55 To 120 Application: Automotive
Packaging: Embossed Type Date Code: Newest
Quality: New100%
High Light:

Automotive SMD Chip Capacitor

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TI SMD Chip Capacitor

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TPS23755RJJT

SMD Chip Capacitor Texas Instruments/TI TPS23755RJJT

ECAD Module PCB Symbol,Footprint & 3D Model
Supply and Demand Status Balance
Popularity High
Fake Threat In the Open Market 82 pct.
Quantity per package 250
HTSUS 8542.39.0001
ECCN EAR99
REACH Status REACH Unaffected
MSL Level 2 (1 Year)
Case / Package 24-VSON (6x4)
Package 24-VFDFN Exposed Pad, 23 Leads
Mounting Surface Mount
Operating Temperature Range -40°C ~ 125°C (TJ)
Package Reel - TR
Manufacturer Texas Instruments
Features Power Over Ethernet Controller Channel 802.3at (PoE) 24-VSON (6x4)
Estimated Pruduction Lead Time 25 Weeks
Categories Integrated Circuits (ICs)
Family Name TPS23755
Other Part Number 296-TPS23755RJJTCT, 296-TPS23755RJJTDKR, 296-TPS23755RJJTTR

 

Features for the TPS23755

  • Complete IEEE 802.3at PD solution for type 1 PoE
    • Ethernet Alliance (EA) logo certified designs available
    • Robust 100-V, 0.36-Ω (typ) hotswap MOSFET
    • Programmable classification level
  • Integrated PWM controller with 0.77-Ω (typ) 150-V power MOSFET
    • Flyback controller with PSR
      • Supports CCM operation with secondary side diode rectifier
      • ±3% (typ, 12-V Output) Load regulation (5%-100% range)
    • Supports low-side switch buck topology
    • Adjustable switching frequency with synchronization
    • advanced startup
    • Programmable slew rate and frequency dithering for enhanced EMI reduction
  • Secondary side adapter priority control with smooth transition
  • –40°C to 125°C Junction temperature range
  • Small 6-mm x 4-mm VSON package

Description for the TPS23755

The TPS23755 device combines a Power over Ethernet (PoE) powered device (PD) interface, a 150-V switching power FET, and a current-mode DC-DC controller optimized for flyback topology. The high level of integration along with primary side regulation (PSR), spread spectrum frequency dithering (SSFD), and advanced startup makes the TPS23755 an ideal solution for size-constrained applications. The PoE implementation supports the IEEE 802.3at standard as a 13-W, Type 1 PD.

The PSR feature of the DC-DC controller uses feedback from an auxiliary winding for control of the output voltage, eliminating the need for external shunt regulator and optocoupler. It is optimized for operation with secondary side diode rectifier (typically 12-V output or higher). Typically, the converter operates in continuous conduction mode (CCM) at a switching frequency of 250 kHz.

SFFD and slew rate control helps to minimize the size and cost of the EMI filter. Advanced Startup allows the use of minimal bias capacitor while simplifying converter startup and hiccup design.

Secondary auxiliary power detect capability provides priority for a secondary side power adapter, while ensuring smooth transition to and from PoE input power, with no efficiency or thermal trade-off.

The DC-DC controller features internal soft-start, slope compensation, and blanking. For non-isolated applications, the buck topology is also supported by the TPS23755.

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