TE0813-01-4BE11-A
Specifications
Category:
Integrated Circuits (ICs)
Embedded
Microcontrollers, Microprocessor, FPGA Modules
Product Status:
Discontinued At Digi-Key
Package:
Box
Series:
-
Connector Type:
Board-to-Board (BTB) Socket
Size / Dimension:
2.050" L X 2.990" W (52.00mm X 76.00mm)
Mfr:
Trenz Electronic GmbH
Module/Board Type:
FPGA Core
Co-Processor:
-
Operating Temperature:
0°C ~ 85°C
RAM Size:
2GB
Speed:
-
Core Processor:
Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E
Flash Size:
128MB
Introduction
- Embedded Module Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E 2GB 128MB
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TE0820-02-02EG-1EA |
IC MODULE ZYNQ USCALE 1GB 128MB
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TE0741-02-160-2IF |
IC MOD KINTEX-7 160T 200MHZ 32MB
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TE0728-04-1Q |
IC MODULE CORTEX-A9 512MB
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TE0715-05-71I33-A |
IC SOC MODULE
|
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TE0808-04-6BE21-A |
IC MODULE ZYNQ USCALE 4GB 128MB
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Send RFQ
Stock:
10000
MOQ: